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Headlines
Background
Aircision eyes second-gen free-space optics powered by integrated photonics
As the Eindhoven-based startup Aircision is readying a first wave of ‘fiber optics through the air,’ it’s eyeing integrated photonics to power a next generation of products.
Background
Hybrid bonding heats up as Canon and LG take on established players
Canon and LG are entering the already crowded market for hybrid-bonding equipment. Canon is targeting a 2026 launch, while LG aims to be ready in 2028. Their moves put established players like Besi and ASMPT on alert.
Background
Sensius turns up the heat in the fight against head and neck cancer
Sensius’ RF collar focuses heat precisely on tumors in the head and neck, making them more susceptible to radiotherapy and chemotherapy. Thanks to technological improvements and new clinical studies, this promising complementary treatment is now truly within reach.
Analysis
Intel gets thrown a lifeline
In the Trump era, endorsement of the US government is worth more than billions of dollars.
Background
Future-fitting systems engineering skills across organizational boundaries
Vanderlande and TNO-ESI joined forces to map the skills architects and integration specialists need, to streamline the development of increasingly complex systems. The collaboration has yielded a tailored competency framework and a replicable methodology for other high-tech companies.
Background
Your technical talk with impact? 7 tips for no blah blah
How three Bits&Chips Event speakers transformed their presentations at the annual conference and why you might consider coaching too.
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Background
Emerging advances in ultrasound
Ultrasound imaging became known for non-invasive diagnostics in healthcare and non-destructive material testing in industry. Historical as well as recent advancements in hardware, image and signal-processing algorithms, machine learning and AI, material science and precision manufacturing have considerably boosted its versatility. As a result, the quality and diversity of ultrasound solutions for applications in many different fields have grown significantly.
Analysis
Welcome back! Here’s the lowdown on the summer break
As the holiday season draws to a close, here’s the high-tech news that you might have missed.
News
Startup CDimension takes aim at silicon’s monopoly
Armed with wafer-scale 2D semiconductor materials, US startup CDimension is looking to challenge silicon’s reign in leading-edge CMOS.
Interview
“AFM is uniquely positioned to meet future metrology needs in chip production”
The atomic probing metrology market for in-line inspection applications is a speed race that really took off this year with equipment orders for volume production. Bits&Chips speaks to Peter Jenkins, CEO of Infinitesima, a UK-based AFM provider.
Background
Optics drive Infinitesima’s atomic probe metrology system
Andrew Humphris’ search to capture the movements of complex biological molecules is now resulting in a tool that supports advanced semicon production. A short history and some notes about the technology behind Infinitesima’s rapid probes.
News
And then there were two?
Intel floats the possibility of dropping out of leading-edge manufacturing.
Analysis
ASML and its suppliers walk a tightrope as growth prospects remain shrouded
Faced with the downturn possibly extending well into 2026, preparations for the eventual boom are starting to chafe.